The low viscosity of the adhesive allows it to flow smoothly and evenly around the components, eliminating the risk of excessive pressure or heat that could damage the electronics. Additionally, the low temperature requirement ensures that the sensitive materials and components remain unaffected and unharmed, preserving their integrity and functionality. These unique scientific properties of low pressure molding adhesives provide a safe and reliable encapsulation method for delicate electronics, ensuring their protection throughout the manufacturing process.
The inherent stickiness of low pressure molding adhesives empowers them with exceptional resilience against external factors, including water and other environmental challenges. This adhesive’s strong bond forms a protective barrier, effectively sealing and safeguarding the encapsulated components. By maintaining its adhesive properties even in the face of moisture or other potential hazards, low pressure molding adhesives provide enhanced resistance, ensuring long-lasting and reliable protection.
